CALYTRONICS : 2-Phase Cooling for Electronics

“As Powerful & Efficient As Liquid Cooling...
...As Simple & Safe As Air Cooling”

Calytronics Product Calyos

CALYTRONICS is a comprehensive range of cooling solutions for electronics components (CPU, GPU, ASIC, Memories, etc.) in computing servers. Developed for high heat load applications, it is especially suited for High Performance Computing, Data Center, overclocked configurations among others.

Easily adaptable to any type of servers inside air or liquid cooled racks, CALYTRONICS cooling solutions are powerful and fully passive. Using a motionless capillary pump, they provide their users with the best technical solution at the best total cost of ownership.

CALYTRONICS is also applicable to others electronics markets such as telecom, aeronautics, defence, among others.

CALYTRONICS cooling solutions are based upon LOOP HEAT PIPE (LHP) technologies.

A LHP is a sealed 2-phase cooling device composed of an evaporator (with integrated capillary pump and reservoir), a tubed condenser and connecting lines.

What is a LOOP HEAT PIPE composed of?

Take a look at Calyos 2-Phase Enhanced Air Cooling solution
for Data Centers Servers.
CPU Calytronics Calyos
Evaporator Calytronics Calyos
Flexible 1 Calytronics Calyos
Flexible 2 Calytronics Calyos
Air Heat Exchanger Calytronics Calyos
Fan Calytronics Calyos
CPU Calytronics Calyos
Printed Circuit Board
CPU Calytronics Calyos
Evaporator Calytronics Calyos
Evaporator
Evaporator Calytronics Calyos
Flexible 1 Calytronics Calyos
Vapor line
Flexible 1 Calytronics Calyos
Flexible 2 Calytronics Calyos
Liquid line
Flexible 2 Calytronics Calyos
Air Heat Exchanger Calytronics Calyos
Air Heat Exchanger
Air Heat Exchanger Calytronics Calyos
Fan Calytronics Calyos
Fan
Fan Calytronics Calyos

LOOP HEAT PIPES are breakthrough cooling solutions.

Used in Data Center servers, they absorb the heat from the hot components and move it passively to the edges of the case, where heat can be easily removed with an air or liquid heat exchanger. LOOP HEAT PIPES have numerous and significant advantages.

  • Thermal Advantages
  • High heat loads: ranging from 100W to 300W for regular components and up to 1000W for custom components (heat densities up to 100W/cm²).

  • Very low thermal resistance: ranging from 0,05 K/W to 0,20 K/W depending on the application.

  • No “hot spots” anymore: heat being moved to the edges of the server case, components do not suffer from overheating anymore.

  • Mechanical Advantages
  • Easy (retrofit) design: with its custom connecting lines, the solution can be placed anywhere, without constraint on IT design.

  • 3D design: thanks to its capillary pump, designs against gravity can be realised, contrary to regular heat pipes or thermosiphon.

  • Safety & Reliability Advantages
  • No water, no leak: Non-freezing dielectric cooling fluids keep the water outside of the server. Furthermore, with its permanently sealed metallic parts, no leak can occur.

  • No regulation: LHP are autonomous and self regulated devices (no electronic regulation).

  • No maintenance or failure: LHP don’t have any mechanical moving part or power consumption.

  • Cost & Ecological Advantages
  • Passive: LHP are passive, no power or maintenance are required for their operation.

CALYTRONICS Loop Heat Pipes can be used in any type of cooling architecture inside the Data Center.

Available in 3 different types of Heat EXchangers (air, liquid or conduction), CALYTRONICS cooling solutions can be integrated in any type of servers, with any type of Data Center cooling architecture. Each configuration has specific performances.