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Compute

Market Sectors

The term 'compute' represents a wide range of individual computing applications, many of which we have included below. Within computing hardware Calyos is primarily focused on the critical processor, be it a CPU, GPU, ASIC, et cetera. Calyos believes our solution can provide the most impact and meet the performance demands of the latest components, while offering the most sustainable solution on the market.

silicon suppliers
  • CPU
  • GPU
  • ASIC
  • FPGA
server suppliers
  • Storage Servers
  • High Frequency Trading
  • AI & Machine Learning
  • Cryptocurrency Mining
data centers
  • Cloud (Hyperscale)
  • Enterprise
  • Co-location
  • Edge
telco equipment
  • 5G Basestations
  • RF Equipment
  • CMTS
  • Switches
Specific computers
  • High-End Workstations
  • Rugged Computers
  • Silent Computers
  • Gaming Computers

compute

applications

Servers

Servers are used for all kinds of computing applications and have traditionally been air cooled. The combination of processors decreasing in size, while increasing their thermal design power (TDP) has resulted in many of the typical methods of cooling becoming obsolete. Our LHP solutions have the ability to transport the heat anywhere in the server, accessing the maximum airflow to minimize the case temperature of your processor.

Racks

Racks have traditionally been designed for broader building level air conditioning infrastructure. Thermal power continues to increase and is beginning to exceed the limits of inefficient air cooling. Rack systems targeting the processors can drastically increase both chip performance and cooling efficiency. Rack cooling offers the ability to recover waste heat for other applications, rather than just evacuating it into the air. Calyos is currently developing a passive rack cooling solution.

Embedded computing

Embedded electronics can be relevant to a host of different components that require specific cooling needs. In computing the most common application is for embedded computers, be it inside a aeroplane, electric vehicle, defense system, industrial site, or medical area. It is problematic to cool components designed for the clean, safe, consistent environment of a data center when instead they are placed inside a small enclosure often cut off from external airflow. Calyos offers flexible solutions capable of handling the latest components and transporting the heat to the best location to be dissipated.

how does calyos resolve common thermal challenges?

Calyos has designed our two-phase thermal solutions to be easy to adopt, while resolving many of the common challenges faced by engineers today. Calyos encourages our clients to remain open minded in their approach. You can combine our solutions with other cooling systems or replace systems entirely, it's up to you. Calyos will work with you to resolve whatever challenges you face and you can be safe in the knowledge that two-phase, passive systems are the most sustainable cooling solutions on the market today.

high Heat density

The latest components are forever increasing in total thermal power and heat density. Vaporising (two-phase) systems have a better ability to handle the highest heat flux than single phase.

easy to adopt

Our solutions are built from off the shelf components, connected by lines routed around other components, based on the mechanical design of your specific application.

small packaging size

Our compact solutions use thin and flexible lines to reach remote heat and cold sources without interfering with other components. Plus there is no pump to find space for.

fit & forget reliability

Our systems have no moving parts and every system is helium tested for tightness before it leaves the factory. Combine that with our dielectric fluid and the result is best in class reliability.

loop heat pipe for data center servers

LHP-DCS

Our trusted flagship technology has long been deployed in server environments and more recently we have expanded into the telecommunications market. Calyos utilises standard components to build a solution specific to your mechanical design, with our inherent fit-and-forget reliability.

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loop heat pipe for data center racks

LHP-DCR

Calyos aims to accelerate the sustainable transition of data centers from air cooling to full liquid cooling, notably enabling heat recovery capabilities. The inevitable next step for our product development is to transition our technology from single server to full rack cooling.

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loop heat pipe for embedded electronics

LHP-EE

This is the most flexible solution for cooling embedded electronics on the market. Ultra reliable and maintenance free, our solution is ideal for even the most harsh environments. The system is able to access any remote cold source no matter the size or type.

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compute

Use Cases

Using a 280mm radiator mounted above the evaporator this solution is capable of cooling a processor dissipating 300W. This is ideal for reliability critical applications due to the inherent fit and forget nature of an LHP-EE solution.

Workstation

Compute

:

Workstation

Using a 280mm radiator mounted above the evaporator this solution is capable of cooling a processor dissipating 300W. This is ideal for reliability critical applications due to the inherent fit and forget nature of an LHP-EE solution.
LHP-EE
Here Calyos was targeting two 350W CPUs inside a 1U server chassis. The design was optimized for 75 CFM, ensuring quiet operation.

2x CPU

Compute

:

Server

Here Calyos was targeting two 350W CPUs inside a 1U server chassis. The design was optimized for 75 CFM, ensuring quiet operation.
LHP-DCS
Here one 600W CPU, with >150W hotspots, is inside a 2U chassis with 300CFM of airflow. Transporting the heat to the rear of the chassis enabled maximum airflow.

1x CPU

Compute

:

Server

Here one 600W CPU, with >150W hotspots, is inside a 2U chassis with 300CFM of airflow. Transporting the heat to the rear of the chassis enabled maximum airflow.
LHP-DCS
Here a very low case temperature was targeted for a 300W FPGA in a 1U chassis by transporting the heat to an area where the air exchanger size and airflow can be maximized.

1x FPGA

Compute

:

Server

Here a very low case temperature was targeted for a 300W FPGA in a 1U chassis by transporting the heat to an area where the air exchanger size and airflow can be maximized.
LHP-DCS

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