Mosfet Good Format.jpg
 

Mosfet

Thermal Challenges

  • Footprint reduction involving very high heat densities (>100W/cm²)

  • Power restraint due to thermal limitation

  • Internal thermal resistance restricts cooling budget

Calyos Expertise

  • Thermal chain analysis to assess the budget available for the cooling device;

  • High performance dielectric TIM selection to optimise thermal budget for cooling device;

  • Cooling technology selection according to targeted power and related heat density as well as mechanical integration constraints;