One of our solutions developed for Railway :

 
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  • Heat source : IGBT (Si), Mosfet (SiC, GaN)

  • Thermal power: up to 2.5 kW and 64 components per power module

  • Foot print: up to 190 x 140 mm²

  • Heat density : 30 W/cm² on real module and tested up to 100W/cm² on heating tool

  • Cold source: Ambient air (Natural convection and/or wind speed)

  • Cold source temperature : -40°C to +50°C

  • Operating conditions: acceleration & braking induce fast and well determined power cycles

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  • Optimize product’s TCO

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  • Analyze power module thermal characteristics (hotspots, internal thermal resistance…)

  • Define worst case operating conditions with respect to heat exchanger location and train directions (roof, floor)

  • Transient optimization of the air exchanger (gap, thickness, orientation of the fins) based on the power cycle of each electrical function and speed wind,

  • Benchmark cooling technology advantages and limitations to achieve the best TCO,

  • Select the two-phase technology [VD1] and design a product offering:

    • High thermal performances to keep the electronic devices at optimum temperature

    • Full passivity limiting the risk of breakdown and maintenance : No Pump, no forced convection needed, 40 years guarantee

    • Reduce thermal swing of the component junction thanks to the “auto regulation” (longer electronic lifetime) capability

  • Numerical models: determine equivalent pressure drop reduced models for CFD and thermal R-C equivalent network at train level

  • Qualification:

    • Thermal, lab and climate chamber

    • Mechanical, Shocks and vibrations, Salt mist, etc.

    • 2 years commercial operation in Paris Line 1


Final Product Developed