Heat source : Hot side of the thermoelectric cooler (TEC I.E. Peltier element)

Power per component : 75W (2 components)

Heat density : 5W/cm²

Cold source: Ambient air (Forced convection)

Cold source temperature : -5°C to +40°C

Operating conditions: Transportable device

Avoid mechanical breakdown of the ceramic substrate due to pipe connection during the plugging of the analyzer and the heatsink weight  

Support recurring shock and vibration

Thermal modelization of the TEC component itself based on electrical efficiency

Proposition of new TEC to optimize the overall efficiency (TEC + cooling)

Confirm that Thermal specifications are easily achievable and major challenge comes from mechanical integration

Analyze available volume into the box

Select the Loop heat Pipe technology for the mechanical decoupling between the air exchanger and the evaporator to reduce drastically the mechanical constraints on the substrate frame

Retrofit approach, design a product integrating the heat exchanger into the box and connecting it to the evaporator with custom tube routing;

Prototyping and tests

Mechanical solution achieved as well as an overall analyzer performances  improvement