Request a free initial feasibility analysis to provide you with estimates for the thermal performance, mechanical design, and cost.

Electronic Components

New technologies and packaging requirements are resulting in smaller and smaller electronics that produce more and more heat.

Components are often used in harsh environments with little access to airflow for traditional cooling.
The desire for compact packaging is restricting typical cooling methods.
Passive cooling is difficult to achieve without going two-phase.

Which components can be cooled?

Calyos provides solutions for all types of embedded processors.

LEDs
Sensors
Lasers
RF Components
ECU
Peltier / TEC

What solutions does Calyos offer?

Calyos offers two solutions for cooling electronic components, each with their own merits.

Loop Heat Pipes

LHPs provide the ability to not only handle very high heat flux, but also to transport heat over long distances.

Why this solution?

A high performance solution typically used for dissipating heat from >150W electronic components transporting the heat long distance to an appropriate cold source.

Ability to cool the latest high heat flux components effectively, increasing their efficiency.
Long distance transport of heat provides option to dissipate the heat passively, yet far away from the heat source itself.
Easily scalable to the number of components that require cooling, collecting the heat and dissipating it in one location.

How can you customize this solution?

Evaporator Size & Mounting

The size and mounting plates can be customized to your processor and socket.

Number of Evaporators

Multiple evaporators can be configured together using parallel lines.

Line Routing

Lines can be routed around other components on the PCB, plus flexible lines allow for serviceability.

Condenser Type & Size

Different technologies such as conductive plates and air exchangers can be used as needed.

Micro Channel Heat Pipes

MCHPs are a hybrid HP-PHP solution that remains a simple and lightweight ultra-efficient cooling solution.

Why this solution?

A low cost, simple solution typically used for dissipating heat from <150W electronic components to adjacent surfaces. The shape can be customized easily to suit your application.

Low cost, lightweight, unique aluminium heat pipe design provides passive heat dissipation.
Thin extrusion easily interfaces with electronic components and flat surfaces to dissipate heat.
Dielectric fluid poses no risk of short circuits and is sealed within the heat pipe.

How can you customize this solution?

Bends

Customize angle and location of bends to enable better integration within a battery pack.

Length

Customize the length based on the geometry of the cell.

Width & Thickness

Customize both the thickness and the width of the MCHP.

Cross Section Profile

Design new cross sectional shapes
(such as this triangular concept) to suit your geometry.

Our two-phase cooling systems always bring three clear benefits:

Passive & Pump Free

Ultra Reliable & Zero Maintenance

High HTC & Low Thermal Resistance

Use Cases

There are thousands of use cases for our technology. Here we have selected a few examples to give you an idea of how our solutions can be used. Don't be afraid if you have something different - reach out to us and we can validate the application through an initial feasibility analysis.

request feasibility Analysis
This portable solution was designed to improve the lifetime of the Peltier module it is cooling. It solved the mechanical challenge with a drastic reduction in the size and weight vs the previous solution. The design features flexible lines to ease installation and use.

Specialized Equipment

:

Gas Analyzer

This portable solution was designed to improve the lifetime of the Peltier module it is cooling. It solved the mechanical challenge with a drastic reduction in the size and weight vs the previous solution. The design features flexible lines to ease installation and use.
Research prototype to investigate the impacts of vibrations and orientations on the PHPs performance.

E-Mobility

:

Aeronautic

PHP for Electronic Components

Research prototype to investigate the impacts of vibrations and orientations on the PHPs performance.
Implementing a Calyos solution enabled the use of the high-power LEDs totalling 300W. The exchange surface was reduced from 3.8m² to 2.1m² and the weight by 1.5kg. Notably the LHP-EE system was operating against gravity.

Specialized Equipment

:

Lighting

LED Floodlight

Implementing a Calyos solution enabled the use of the high-power LEDs totalling 300W. The exchange surface was reduced from 3.8m² to 2.1m² and the weight by 1.5kg. Notably the LHP-EE system was operating against gravity.

LHP-EE

Solution Sheet

Our solution sheet includes on general specification, operating information, system materials and typical evaporators and condensers.

Download Solution Sheet

Let's Get Started

Schedule an introductory call with one of Calyos' two-phase experts.

Request Intro