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Use cases
There are thousands of use cases for our technology, below we have included many examples as to where our technology can be used. All of our use cases have been validated through client projects, including some with the partners listed below. Don't be afraid if you have something different - reach out to us and we can validate the application through a feasibility study.
1x CPU
Compute
:
Server
Here one 600W CPU, with >150W hotspots, is inside a 2U chassis with 300CFM of airflow. Transporting the heat to the rear of the chassis enabled maximum airflow.
Designed to fit inside an existing cabinet, the heat pipe systems was able to cool two rows of IGBTs. Fans assist with the airflow through the air exchanger.
Our solution was designed to remove 2.4kW of thermal power from the inverter and recover this energy by pre-heating the HVAC system. Our LHP-PE solution transported the heat over 4m, completely passively, proving our ability to transport heat over long distance against accelerations.
Our solution was designed to remove 5.5kW of thermal power from the batteries to enable ultra-fast charging. Our UHP-BT solution involved 45 heat pipes, each removing 122W of thermal power.
Our solution eliminated the temperature difference between the top and bottom of the cells, while also reducing the Delta T between the cells and the water cold plate.
This portable solution was designed to improve the lifetime of the Peltier module it is cooling. It solved the mechanical challenge with a drastic reduction in the size and weight vs the previous solution. The design features flexible lines to ease installation and use.
Here a very low case temperature was targeted for a 300W FPGA in a 1U chassis by transporting the heat to an area where the air exchanger size and airflow can be maximized.
In this application a high MTBF was critical. Our solution delivered that, while also ensuring an IP66 rating with a 100% passive solution (no fans). The cooling of two 150W components was achieved with completely natural convection.
Implementing a Calyos solution enabled the use of the high-power LEDs totalling 300W. The exchange surface was reduced from 3.8m² to 2.1m² and the weight by 1.5kg. Notably the LHP-EE system was operating against gravity.
Using a 280mm radiator mounted above the evaporator this solution is capable of cooling a processor dissipating 300W. This is ideal for reliability critical applications due to the inherent fit and forget nature of an LHP-EE solution.
A solution capable of cooling up to 800W, completely passively, using the conductive plate as a cold source. The design also operates in anti-gravity and has passed stringent military testing including dust, vibrations, accelerations, impact, and liquid ingress.
Our solution cooled 8 IGBT modules, with a total thermal power of 11.2kW. By reducing the thermal resistance of the cooling system, the client could reduce the number of IGBT modules reducing cost significantly. There are also no pumps, nor fans drastically reducing maintenance.
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