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Servers

Advancements in nanometer lithography combined with demanding workloads from AI are resulting in computer processors that are producing more waste heat at an increased density.

Smaller nanometer lithography is resulting in extremely high heat flux's.
Higher power processors are dissipating more and more heat.
Restricted space within and above each server to maximise rack density.

What solutions does Calyos offer?

Calyos' primary solution for cooling servers uses our Loop Heat Pipe technology.

Loop Heat Pipes

LHPs provide the ability to not only handle very high heat flux, but also to transport heat over long distances.

Why this solution?

Our technology has long been deployed in server environments and more recently we have expanded into the telecommunications market. Calyos utilizes standard components to build a solution specific to your mechanical design, with our inherent fit-and-forget reliability.

Dielectric fluid poses no risk of short circuits.
Ability to cool the latest CPUs, GPUs, FPGAs and ASICs.
Transport heat to available space inside the server.

How can you customize this solution?

Evaporator Size & Mounting

The size and mounting plates can be customized to your processor and socket.

Number of Evaporators

Multiple evaporators can be configured together using parallel lines.

Line Routing

Lines can be routed around other components on the PCB, plus flexible lines allow for serviceability.

Condenser Type & Size

Different exchanger technologies like skived fins or parallel channels can be used as needed.

What about a passively cooled rack?

Calyos has begun developing a passive technology cooling system for data center racks. The system transports the heat to the top of the rack where it can be exchanged with the facility water system (FWS).

Only a passive CDU (no pumps) is used to dissipate the heat from the rack into the FWS.
No pre-heat affect and no unneccessary pumping of fluid when load is low.
Patented technology based on capillary jet loop is a unique invention from our CTO.

Interested to learn more? Reach out to us and we can present the full solution.

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Use Cases

There are thousands of use cases for our technology. Here we have selected a few examples to give you an idea of how our solutions can be used. Don't be afraid if you have something different - reach out to us and we can validate the application through an initial feasibility analysis.

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Here one 600W CPU, with >150W hotspots, is inside a 2U chassis with 300CFM of airflow. Transporting the heat to the rear of the chassis enabled maximum airflow.

Computing

:

Server

1x CPU

Here one 600W CPU, with >150W hotspots, is inside a 2U chassis with 300CFM of airflow. Transporting the heat to the rear of the chassis enabled maximum airflow.
Here Calyos was targeting two 350W CPUs inside a 1U server chassis. The design was optimized for 75 CFM, ensuring quiet operation.

Computing

:

Server

2x CPU

Here Calyos was targeting two 350W CPUs inside a 1U server chassis. The design was optimized for 75 CFM, ensuring quiet operation.
Here a very low case temperature was targeted for a 300W FPGA in a 1U chassis by transporting the heat to an area where the air exchanger size and airflow can be maximized.

Computing

:

Server

1x FPGA

Here a very low case temperature was targeted for a 300W FPGA in a 1U chassis by transporting the heat to an area where the air exchanger size and airflow can be maximized.

Our two-phase cooling systems always bring three clear benefits:

Passive & Pump Free

Ultra Reliable & Zero Maintenance

High HTC & Low Thermal Resistance

LHP-dCS

Solution Sheet

Our solution sheet includes on general specification, operating information, system materials and typical evaporators and condensers.

Download Solution Sheet

Let's Get Started

Schedule an introductory call with one of Calyos' two-phase experts.

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