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Calyos to Attend Semi-Therm's 39th Annual Symposium


San Jose, California


February 27, 2023

Calyos is going to attend Semi-Therm's Annual Symposium and will be presenting both a short course and technical session.

Calyos, a Belgian technology company focusing on a sustainable offering of advanced heat pipe thermal management solutions within e-mobility, computing, and renewable energy markets, is delighted to announce our attendance at Semi-Therm's 39th Annual Semiconductor Thermal Measurement, Modeling, and Management Symposium in San Jose. The event will take place from March 13-17th, and Calyos will not only have a booth, but is also presenting a technical session and running a short course. Read more about the details of each aspect below.

Short Course: Understanding, applying, and estimating the performance of advanced two-phase heat pipe systems

On Monday 13th March, Calyos will be presenting this short course. The course will be led by Olivier de Laet, Founder of Calyos, in partnership with Vincent Dupont, CTO of Calyos. Both bring over 20 years of expertise in two-phase technology and the course is explained in detail here:
>The course will start by providing an explanation of the physics behind heat pipes, and then using this foundational knowledge to explain micro-channel, loop and pulsating heat pipes. The lecturer will then present the trade-offs between the different heat pipe technologies including both thermal, mechanical, and environmental constraints. The course will then focus on applying the technologies to real-world applications, including presenting some concrete examples that Calyos has already worked on. The room will then break for a brainstorming session where attendees can take a real-world application they imagine (based on their expertise). They will then discuss with the people around them and select an appropriate heat pipe technology for their application and note down their reasoning. The lecturers will spread throughout the room, taking questions and supporting attendees in selecting and reasoning. Following the brainstorming session, volunteers will be asked to come and present their application and chosen technology, explaining their reasoning. The lecturers and additional experts will discuss and evaluate the technologies learning as a group. The next stage of the session will take three of the attendee applications and break down the thermal resistance chain. This is the first step in order to estimate/simulate the performance. The lecturer will explore the physics behind each step, discussing points to note with the attendees. By adding some basic parameters to the application and using typical HTC values the team can then begin to estimate the performance of a system and show how this can be taken further (ie. With CFD, models, etc).

Technical Session: A Loop Heat Pipe for Vehicle CPU Cooling, Peak Performance, Partial Flooding and Dry Out Regimes

Additionally between the 14th and 16th March, Olivier de Laet, the founder of Calyos will be presenting this technical paper. The paper was written by team members at the University of Michigan, General Motors and Calyos. The abstract of the paper can be read here:
>A Loop Heat Pipe (LHP) is assembled and tested for removing up to 400 W from two vehicle CPUs, while keeping their temperature under 95°C and using a 2 m-distanced, 45°C-air cooled condenser, and working fluid R1233zd(E). The capillary evaporator wick uses a liquid artery wick supplying liquid to a sawtooth copper wall evaporator. This novel sawtooth structure extends the evaporation area, spreads the liquid, and allows for the vapor escape space, while minimizing the evaporator resistance. For the application flexibility, it is preferred to place the condenser away from the CPUs. The air-cooled condenser fan-power consumption is also important, influencing the condenser thermal resistance. The loop thermal-hydraulics are analyzed (including the wick effective thermal conductivity, permeability, and maximum capillary pressure) and modeled. These include the role of the liquid accumulation on the evaporator, and the partial, local wick dryout under statistical variation in the microlayer wick thickness. The condenser thermal resistance and pressure drop, the transfer lines pressure drops, and the accumulator volume, which can dominate and limit the overall performance, are addressed in the design selection. The model predictions are compared with the performance of the fabricated LHP under variable thermal load and CPU-condenser separation distance. Good agreements are found, under partial flooding at low thermal load, under partial dryout at high thermal load, as well as under thermal loads with peak evaporator performance. Further improvements realized in the second-generation evaporator wick is expected to raise the peak performance and the maximum thermal load significantly.

Exhibitor Booth

Alongside both the technical session and the short course, Calyos will be hosting an exhibitor booth at the conference. The booth will showcase a selection of our advanced heat pipes including LHPs, MCHPs and PHPs. Calyos recognise's the value of getting hands on with our technologies to better understand not only how they work but also how they can be implemented.

We encourage you to visit the symposium, you can register at the link below. The Calyos team is looking forward to meeting and interacting with attendees at the symposium and sharing their expertise in advanced heat pipe solutions.

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