A representative from Calyos will reach out to you to plan an introductory web call where they will explain how our technology works and demonstrate the applications and benefits of it.
Computing is moving out of the central data center and closer to where data is created, into micro data centers, containerized modules, telecom sites and edge AI nodes. These sites pack server-class processors into compact enclosures that are often unmanned and hard to reach for maintenance.
From a single edge server to a containerized data center, Calyos cools the processors that power computing outside the central data center. Reach out to see if we can cool your system.
Calyos offers two solutions for cooling edge computing hardware, each with their own merits.
LHPs provide the ability to not only handle very high heat flux, but also to transport heat over long distances.
A high performance solution typically used for dissipating heat from >150W electronic components transporting the heat long distance to an appropriate cold source.
The size and mounting plates can be customized to your processor and socket.
Multiple evaporators can be configured together using parallel lines.
Lines can be routed around other components on the PCB, plus flexible lines allow for serviceability.
Different technologies such as conductive plates, air exchangers or the enclosure wall itself can be used as needed.
MCHPs are a hybrid HP-PHP solution that remains a simple and lightweight ultra-efficient cooling solution.
A low cost, simple solution typically used for dissipating heat from <150W electronic components to adjacent surfaces. The shape can be customized easily to suit your application.
Customize the angle and location of bends to enable better integration within your enclosure.
Customize the length based on the geometry of your board and enclosure.
Customize both the thickness and the width of the MCHP.
Design new cross sectional shapes
(such as this triangular concept) to suit your geometry.
Passive & Pump Free
Ultra Reliable & Zero Maintenance
High HTC & Low Thermal Resistance
There are thousands of use cases for our technology. Here we have selected a few examples to give you an idea of how our solutions can be used. Don't be afraid if you have something different - reach out to us and we can validate the application through an initial feasibility analysis.
request feasibility Analysis
Data Centers & Computing
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Edge AI
Event
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September 28, 2026
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Press Release
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June 11, 2026
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