A representative from Calyos will reach out to you to plan an introductory web call where they will explain how our technology works and demonstrate the applications and benefits of it.
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At the International Heat Pipe Conference we are part of the team that has been awarded: The Don Ernst Award in the technical application paper category.
We are glad to announce that at the International Heat Pipe Conference we are part of the team that has been awarded:
The Don Ernst Award in the technical application paper category
This is for the presentation and paper: Using Loop Heat Pipe solutions, and a dielectric fluid, to cool SiC MOSFET power modules for aircraft systems (Nicolle T., Kapaun F., Lasserre P., Piaud B., Dupont V., Ybanez L.)
Abstract
"In the scope of a technical exploration for an aircraft application four LHPs working with R-1233zd(E) have been designed and adapted to cool the four sides of the two specific double-sided power modules (DSPM). Four air exchangers equipped with fans reject the heat to the air. The present paper discusses the iterative thermal design methodology used to optimize the evaporator wall thickness to the location of the SiC chips on the substrate and the experimental performances of a demonstrator able to transfer up to 170W per MOSFET with an estimated heat flux of 675W/cm² at chip level."
Partners
Calyos worked alongside a number of partners on this paper including:
Calyos Comment
Due to the limited budget and short timeframe we had to use off-the-shelf building blocks to create our solution adding additional complexity to this already advanced thermal challenge!
Vincent Dupont
Chief Technology Officer
Further reading:
International Heat Pipe Conference Website
