By clicking “Accept All Cookies”, you agree to the storing of cookies on your device to enhance site navigation, analyze site usage, and assist in our marketing efforts. View our Privacy Policy for more information.
A representative from Calyos will reach out to you to plan an introductory web call where they will explain how our technology works and demonstrate the applications and benefits of it.
A common thermal management solution for miniaturized electronic devices with high heat flux values is to integrate the heat spreader and the heat sink so that the forced or free convection is promoted. Taking advantages of thin and wickless simple structure of Pulsating Heat Pipes (PHPs), several studies proposed flat-plate PHPs for this application. In most of the PHP studies, the evaporator and the condenser are located at both ends the PHP. However, in many practical cases, the PHP configuration could be different: it could be used as to spread a centrally located heat source in a three-dimensional direction, achieving high temperature uniformity in a limited space. In the present study, in order to investigate this particular configuration with the evaporator in the centre, a flat-plate PHP is proposed for spreading heat of electronic devices with high heat flux up to 50 W/cm2 and its thermal performance experimentally investigated is shown. Methanol was charged as the working fluid. As the result of changing the filling ratio, the optimum filling ratio was estimated between 59 – 39 %. The thermal performance was evaluated with in four orientations. The thermal resistance in every orientation was less than on-half of that of the empty PHP. The results shown in this work could contribute to improve thermal management of the electronics generating high-heat flux by proposing an innovative heat spreader.
Iwata, N., Bozzoli, F., Accorinti, F., Dupont, V., de Ryckel, A.
39th International Conference on Heat and Mass Transfer
39th International Conference on Heat and Mass Transfer
