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2018

Multi-source miniaturized Loop Heat Pipes for electronics cooling

ABSTRACT

We present a novel architecture of a Loop Heat Pipe in which three auxiliary smooth-pipes evaporators have been added. Auxiliary evaporators feature the hot points of an electronic chip. Such a system would allow cooling down several hot spots by using a single-LHP and is of a broad interest for electronics cooling applications. This system preserves the main advantages of multi-capillary evaporators LHPs while avoiding numerous of their downsides. Our breadboard has the following characteristics: out of the main capillary evaporator, the LHP line crosses a first condenser, the three auxiliary evaporators-referred as "micro-exchangers", a second condenser, and then returns to the evaporator. The main capillary evaporator drives the mass flow rate while auxiliary evaporators are only dedicated to heat transfer. The working fluid is R245fa. Experimental investigations allow characterizing the loop behavior and the operating limits in order to deduce the operating conditions. Measurements agree with our multi-evaporators LHP model. We also point out that, before the onset of nucleate boiling within micro-exchangers, the liquid superheating may achieve 40 °C. In some cases, however, the ONB occurs immediately after applying the power to micro-exchangers.

AUTHORS

Fourgeaud, L., Mari, R., Figus, C., Dupont, V.

CONFERENCE
PAPER

32nd European Space Thermal Engineering Workshop

32nd European Space Thermal Engineering Workshop

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