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In the scope of a technical exploration for an aircraft application four LHPs working with R-1233zd(E) have been designed and adapted to cool the four sides of the two specific double-sided power modules (DSPM). Four air exchangers equipped with fans reject the heat to the air. The present paper discusses the iterative thermal design methodology used to optimize the evaporator wall thickness to the location of the SiC chips on the substrate and the experimental performances of a demonstrator able to transfer up to 170W per MOSFET with an estimated heat flux of 675W/cm² at chip level.
Nicolle, T., Kapaun, F., Lasserre, P., Piaud, B., Dupont, V., Ybanez, L.
Joint 20th IHPC and 14th IHPS
Joint 20th IHPC and 14th IHPS
